igbt Semi-Conductors Electronic Parts

Insulated Gate Bipolar Transistors (IGBT)
NTE
Type
Number
Description
and
Application
Case
Style
Collector to
Emitter
Breakdown
Voltage
(Volts)
Gate to
Emitter
Cutoff
Voltage
(Volts)
Gate to
Emitter
Breakdown
Voltage
(Volts)
Maximum
Collector
Current
(Amps)
Collector to
Emitter
Saturation
Voltage
(Volts)
Input
Capacitance
(pf)
Device
Total Power
Dissipation
@ TC= +25°C
(Watts)
V(BR)CESVGE(Off)BVGESICVCE(sat)CiesPD
3300
N-CHANNEL
Enhancement
Mode High
Speed Switch
TO220
Full
Pack
400 Min7 Max±25 Max108.0 Max1350 Typ30 Max
tr = 0.50µs, ton = 0.50µs, tf = 6µs, toff = 7µs
3301
N-CHANNEL
Enhancement
Mode High
Speed Switch
TO220
Full
Pack
400 Min7 Max±25 Max158.0 Max2000 Typ40 Max
tr = 0.50µs, ton = 0.50µs, tf = 6µs, toff = 7µs
3302
N-CHANNEL
Enhancement
Mode High
Speed Switch
TO220
Full
Pack
600 Min6 Max±20 Max84.0 Max650 Typ30 Max
tr = 0.60µs, ton = 0.80µs, tf = 0.35µs, toff = 1µs
3303
N-CHANNEL
Enhancement
Mode High
Speed Switch
TO220
Full
Pack
600 Min6 Max±20 Max154.0 Max1100 Typ35 Max
tr = 0.60µs, ton = 0.80µs, tf = 0.35µs, toff = 1µs
3310
N-CHANNEL
Enhancement
Mode High
Speed Switch
TO3P600 Min6 Max±20 Max154.0 Max1100 Typ100 Max
tr = 0.60µs, ton = 0.80µs, tf = 0.35µs, toff = 1µs
3311
N-CHANNEL
Enhancement
Mode High
Speed Switch
TO3P600 Min6 Max±20 Max254.0 Max1400 Typ150 Max
tr = 0.30µs, ton = 0.40µs, tf = 0.15µs, toff = 0.50µs
3312
N-CHANNEL
Enhancement
Mode High
Speed Switch
TO3P1200 Min6 Max±20 Max84.0 Max1150 Typ100 Max
tr = 0.30µs, ton = 0.40µs, tf = 0.25µs, toff = 0.80µs
3320
N-CHANNEL
Enhancement
Mode High
Speed Switch
-600 Min6 Max±20 Max504.0 Max3500 Typ200 Max
tr = 0.30µs, ton = 0.40µs, tf = 0.15µs, toff = 0.50µs
3321
N-CHANNEL
Enhancement
Mode High
Speed Switch
-600 Min6 Max±20 Max803.5 Max5500 Typ200 Max
tr = 0.30µs, ton = 0.50µs, tf = 0.25µs, toff = 0.70µs
3322
N-CHANNEL
Enhancement
Mode High
Speed Switch
-900 Min6 Max±25 Max603.7 Max5300 Typ200 Max
tr = 0.25µs, ton = 0.35µs, tf = 0.25µs, toff = 0.50µs
3323
N-CHANNEL
Enhancement
Mode High
Speed Switch
-1200 Min6 Max±20 Max254.0 Max3200 Typ200 Max
tr = 0.30µs, ton = 0.40µs, tf = 0.25µs, toff = 0.80µs

DESCRIPTION
NTE's series of Insulated Gate Bipolar Transistors (IGBTs) combine the high input impedance and high speed characteristics of MOSFETs and the high conduction (low saturation voltage) characteristics of bipolar transistors. Their structure looks very much like a MOSFET except that MOSFETs use an N+ - N- type substrate whereas IGBTs use a P+ - N- type substrate.

The thyristor fromed by PNP - NPN transistor coupling has its base and emitter shorted by aluminum patterning to disable it from operating and is therefore considered irrelevant to the basic operation of IGBTs. Consequently, the equivalent circuit and basic operating mechanism of IGBTs are the same as those of a MOS-input inverted Darlington transistor comprised of an N-channel enhancement MOSFET in its input stage and a PNP transistor on the output stage.

IGBTs are constructed in such a way that first, the gate voltage is applied to form a channel and then the base current of the PNP transistor is supplied, letting the circuit turn on eventually as an IGBT. Conversely, when turned off, the channel is eliminated to turn off the base current. Thus, IGBTs are driven in exactly the same way as MOSFETs, and IGBTs have high input impedance characteristics just like MOSFETs.

IGBT Symbol
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