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Absolute Maximum Ratings:
| Reverse Breakdown Voltage, VR | 6V | |
| Forward Current, IF Continuous Peak Pulse |
100mA 1A | |
| Device Power Dissipation (TA = +25°C, Note 1), PD | 100mW | |
| Derate Above +55°C | 2mW/°C | |
| Operating Ambient Temperature Range, Topr | -40° to +100°C | |
| Storage Temperature Range, Tstg | -40° to +100°C | |
| Lead Temperature (During Soldering, Note 2), TL | +260°C |
| Note 1. | Measured with device soldered into a typical printed cirfcuit board. |
| Note 2. | Maximum exposure time: 5sec. Minimum of 1/16 inch from the case. A heat sink should be applied in order to prevent that case temperature from exceeding +100°C. |
Electrical Characteristics: (TA = 0mA°C to +70°C, Note 1 unless otherwise specified)
| Parameter | Symbol | Test Conditions | Min | Typ | Max | Unit |
| Reverse Leakage Current | IR | VR = 6V | - | 0.05 | 100 | µA |
| Forward Voltage | VF | IF = 50mA | - | 1.3 | 1.5 | V |
| Temperature Coefficient of Forward Voltage | - | -1.6 | - | mV / °C | ||
| Capacitance | C | V = 0V, f = 1MHz | - | 24 | 50 | pF |
| Peak Emission Wavelenght | IF = 50mA | 930 | 940 | 950 | nm | |
| Spectral Half Power Wavelenght | - | 48 | - | nm | ||
| Spectral Output Temperature Shift | - | 0.3 | - | nm / °C | ||
| Axial Power Output Intensity | PO | IF = 20mA, Note 3 | 50 | 150 | - | µW / sq. cm |
| Intensity Per Unit Solid Angle | Ee | IF = 20mA, Note 3 | 0.2 | 0.65 | - | mW / Sr |
| Power Half-Angle | - | ±20 | - | ° | ||
| Rise Time and Fall Time | tr, tf | - | 1.0 | - | µs |
| Note 3. | measured using a 11.28mm diameter detector placed 21mm away from the device under test. |