| Power Dissipation, PD | 75mW | |
| Forward Current, IF | 50mA | |
| Peak Forward Current (Note 1), IFM | 1A | |
| Reverse Voltage, VR | 6V | |
| Operating Junction Temperature Range, Topr | -25° to +85°C | |
| Storage Temperature Range, Tstg | -40° to +85°C | |
| Lead Temperature (During Soldering, Note 2), TL | +260°C |
| Note 1. | Pulse Width </= 100µs, Duty Ratio = 0.01. |
| Note 2. | For 3 seconds at a distance of 2.5mm from the bottom face of the resin package. |
Electro-Optical Characteristics: (TA = +25°C unless otherwise specified)
| Parameter | Symbol | Test Conditions | Min | Typ | Max | Unit |
| Forward Voltage | VF | IF = 20mA | - | 1.2 | 1.4 | V |
| Peak Forward Voltage | VFM | IFM = 500mA | - | 3.0 | 4.0 | V |
| Reverse Current | IR | VR = 3V | - | - | 10 | µA |
| Terminal Capacitance | Ct | V = 0V, f = 1MHz | - | 50 | 100 | pF |
| Radient Flux | IF = 20mA | 0.7 | 1.0 | 2.0 | mW | |
| Peak Emission Wavelength | IF = 5mA | - | 950 | - | nm | |
| Half Intensity Wavelength | IF = 5mA | - | 45 | - | nm |
